noun
junction temperature; bonding temperature; welding temperature
Technical term used in semiconductor engineering and materials science. Refers to the temperature at a junction (e.g., in a transistor) or the temperature required for diffusion bonding/welding.
半導体の信頼性を評価するには、接合温度を正確に測定する必要がある。
To evaluate semiconductor reliability, it is necessary to accurately measure the junction temperature.
拡散接合では、接合温度と圧力が重要なパラメータとなる。
In diffusion bonding, the bonding temperature and pressure are important parameters.
Compound of 接合 (setsugō, 'joining, junction') and 温度 (ondo, 'temperature').