Analyzer
Sentence analysis
10Spans
Sentence
Span Details
ダイシング
dicing (semiconductor wafer cutting)noun
工程
process; operation; stage of worknoun
では、
contrastive で + は; then; well thengrammar
ウェハー
wafer-> ウェハnoun
を
object markergrammar
個々
individual; each; separatenoun, no-adjective
の
possession, attribution, nominalizer, or nominal linkergrammar
チップ
tip; gratuity; foul tip; tip (of a ballpoint pen)noun
に
direction, time, indirect object, or target markergrammar
切り分ける。
cut up; cut into pieces; carve; distinguish; isolate; separate outichidan verb