接せつ合ごう温おん度ど

noun

junction temperature; bonding temperature; welding temperature

Technical term used in semiconductor engineering and materials science. Refers to the temperature at a junction (e.g., in a transistor) or the temperature required for diffusion bonding/welding.

• 半はん導どう体たいの信しん頼らい性せいを評ひょう価かするには、接せつ合ごう温おん度どを正せい確かくに測そく定ていする必ひつ要ようがある。

  To evaluate semiconductor reliability, it is necessary to accurately measure the junction temperature.

• 拡かく散さん接せつ合ごうでは、接せつ合ごう温おん度どと圧あつ力りょくが重じゅう要ようなパラメータとなる。

  In diffusion bonding, the bonding temperature and pressure are important parameters.