junction temperature; bonding temperature; welding temperature
Technical term used in semiconductor engineering and materials science. Refers to the temperature at a junction (e.g., in a transistor) or the temperature required for diffusion bonding/welding.
To evaluate semiconductor reliability, it is necessary to accurately measure the junction temperature.
In diffusion bonding, the bonding temperature and pressure are important parameters.
Compound of 接合 (setsugō, 'joining, junction') and 温度 (ondo, 'temperature').