peel strength
Technical term used in materials science and engineering, specifically for the force required to peel a conductor or layer from a substrate.
We need to measure the peel strength of this substrate.
Compound of 引っ張り (hiki-ppari, 'pulling') + 剪断 (sendan, 'shearing') + 強度 (kyōdo, 'strength'). The exact historical derivation is uncertain; the term is a modern technical coinage.